オファリング
提供内容
8 および 4 ノード搭載の高度なマルチノード 4U ツイン・アーキテクチャー サービス性と信頼性を最大限に高める革新的なツイン・アーキテクチャー FatTwin® アーキテクチャーは、独自のデータセンター要件に対応する柔軟性とシステムへのアクセス性を提供します。独自のハーフワイド・ノードでは、ラックユニットあたり 2 個のノードを提供し、これにより、冗長電源をモジュール化した左右のノードは、最大限の信頼性を実現します。ツールレス設計に対応した高度なモジュラー・マルチノード・システム。各ノードは、デュアル第 3 世代インテル® Xeon® スケーラブル・プロセッサーをサポートし、パフォーマンスを向上させます。
提供内容
インテル® Xeon® プロセッサー (開発コード名: Ice Lake-D) 4/8/10 コア、最大 DDR4 3200Mhz 4 チャネル、4 スロット RDIMM/LRDIMM 最大 256GB、1x IPMI 専用 LAN、2x 25G SFP28、4x GbE、2x USB 3.0 タイプ A、3x M.2 (M/B/E-Key)、2x SATA SSD 2.5 インチドライブ、用途: 小売アプリケーション、ファイアウォール、ゲートウェイ、uCPE。
提供内容
エッジ・コンピューティングは、クラウドと物理的な世界を統合し、この次世代のデジタル対応インフラストラクチャーを提供することで、店舗、レストラン、支店でデジタルと没入感のある体験を提供し、市場投入までの時間の短縮を可能にします。Supermicro/Reliant Edge Computing プラットフォームは、小売および接客業向けに事前構成された堅牢なプラットフォームで、仮想化、コンテナ化、監視、機密データのセキュリティー、集中管理のための主要ツールを含み、地理的に分散した数千の拠点でレガシーおよび次世代のアプリケーション、IoT、オペレーティング・システム、デバイスを支えるスケーラブルなインフラストラクチャーを管理します。
提供内容
インテル® Xeon® D プロセッサー (開発コード名: Ice-Lake) 4/8/16/20 コア、最大 DDR4 3200Mhz 4 チャネル、4 スロット RDIMM/LRDIMM 最大 512GB、1 x IPMI 専用 LAN、4 x GbE、2x 10GbE、2 x 25G SFP28 2x USB 3.0 タイプ A、1 x M.2 M-Key SATA/PCI-E 3.0 x4、22802 SATA/U.2 2.5 インチドライブ、マザーボード: X12SDV-4C/8C/16C/20C-SPT8F (7.5 x 8.5 インチ) 1U シャーシ: 515M-R804/515M-R601 幅 17.2 x 奥行 15.7 x 高さ 1.7 インチ (437 x 399 x 43mm)。アプリケーション: ネットワーキング・アプリケーション、ファイアウォール、uCPE、テレコム・アプリケーション
提供内容
Supermicro’s Intelligent Retail Edge is a complete edge computing platform which provides a reliable, flexible, and secure infrastructure solution for retailers, restaurants, and hotels. As local compute across distributed locations becomes increasingly critical for retail operations, these platforms must be deployed, managed, maintained, and secured on a mass scale.
提供内容
Supermicro offers 100% cloud-based edge management total solution. The solution connects Apps to Network, Cloud, Data Center or other Edge Gateway through a platform providing a consistent, automated, hardware agnostic, and secure operating model for mass-deployed edge devices and applications. Customers can benefit from highly efficient management by one-click for hundreds of units full stack provisioning.
提供内容
Cost-Effective 2U 4-Node Rackmount ServerTwinPro® systems are designed for simplified deployment and maintenance, and assembled with the highest quality to ensure continuous operation even at maximum capacity.Optimized thermal design for maximum power efficiencyDual socket supported. TDP up to 185W, 2 UPI16 DIMM slots. Up to 4TB ECC RDIMM/LRDIMM DDR4-3200MHzSupport up to 6 hot-swappable SAS/SATA and 2 internal M.2 NVMe SSDs per nodeOnboard dual 10GbE RJ45 ports with Intel® X710-AT2 controller2 PCI-E 4.0 x16 LP expansion slots and 1 PCI-E 4.0 x8 (M.2)2 Redundant 2200W Titanium Level (96%) power supplies
提供内容
Best-in-class Performance and Flexibility Rackmount ServerUltimate Configurability for Enterprise and Telco ApplicationsThe all-new Hyper series represents the latest generation of Supermicro rackmount servers built with the highest performance features to take on the most demanding workloads along with the storage & I/O flexibility that provide a custom fit to your application needs.Telco optimized configurations include short depth, carrier grade (NEBS Level 3) Hyper-E servers with AC & DC power options.Maintenance-friendly design innovations to eliminate the need for tools when servicing the system.High performance 1U & 2U systems with rear I/O and front I/O configurations to meet today’s data center requirementsDual 3rd Gen Intel® Xeon® Scalable processors up to 270W and 32 DIMM slots for maximum memory capacityLightning-fast storage with the latest generation PCI-E 4.0 NVMe SSDs and networking flexibility with AIOM (OCP 3.0 compliant) NIC supportTool-less system design features intended to simplify field serviceability and lower maintenance time
提供内容
Key Features Intel® Atom processor E3940 (9.5W, 4C) Intel® Goldmont microarchitecture 14nm System-on-Chip Up to 8GB 1866MHz DDR3L Non-ECC SO-DIMM in 1 socket Dual LAN with Intel® Ethernet Controller I210-IT 1 M.2 B-Key 2242/3042, 1 Half size Mini-PCI-E 1 HDMI, 1 48-bit LVDS, Intel® HD Graphic 2 independent displays Extension I/O (1 DP/HDMI, 2 PCI-E x1, 2 USB2.0, LPC, SATA, SMBus, Power) 2 USB 3.0 ports (rear), 2 USB 2.0 ports (via headers), 2 COM ports (via headers) Supports 12V DC power input Wide temperature support from -30°C to 75°C The A2SAP-H/-E/-L motherboard provides powerful graphics and increased media processing performance with multi-frame technology. Paired with the Intel® Atom SoC (System-on-a-Chip) processor, the A2SAP-H/-E/-L delivers more computing power for faster memory speeds and bandwidth while maintaining energy efficiency. Utilizing Intel® TCC (Time Coordinated Computing) Technology, the A2SAP-H/-E/-L resolves latency issues in applications and improves determinism across connected devices. The motherboard features advanced technologies such as Intel® Virtualization to improve security and reliability of systems, and Thermal Monitoring to reduce power consumption. It also comes with more I/O ports and high-speed connectivity.
提供内容
Key Features Intel® Atom processor E3940 (9.5W, 4C) Intel® Goldmont microarchitecture 14nm System-on-Chip Up to 8GB 1866MHz DDR3L Non-ECC SO-DIMM in 1 socket Dual GbE LAN with Intel® i210-AT 1 M.2 B-Key 2280, 1 Full size Mini-PCI-E, 1 SATA 3.0 1 HDMI, 1 VGA, 1 48-bit LVDS, Intel® HD Graphic 3 independent displays 1 USB 3.1 Gen2 Type-C port, 2 USB 3.0 ports, 4 USB 2.0 ports, 4 COM ports, 1 SATA 3.0, 8-bit GPIO, SMBus Supports on board TPM 2.0 Supports 12V DC power input The A2SAN and X11SAN motherboard provides powerful graphics and increased media processing performance with multi-frame technology. Paired with the Intel® Atom SoC (System-on-a-Chip) processor, the A2SAN and X11SAN delivers more computing power for faster memory speeds and bandwidth while maintaining energy efficiency. Utilizing Intel® TCC (Time Coordinated Computing) Technology, the A2SAN-H/-E/-L and X11SAN resolves latency issues in applications and improves determinism across connected devices. The motherboard features advanced technologies such as Intel® Virtualization to improve security and reliability of systems, and Thermal Monitoring to reduce power consumption. It also comes with more I/O ports and high-speed connectivity.