Intel's Packaging Databook Chapter 16: Cartridge Packaging
Intel has introduced a variety of innovative package designs over the years: surface mount, small out-line, very thin package, multilayer molded plastic quad flatpacks (PQFP), and the Tape Carrier Package (TCP) format. Recent configurations for optimum microprocessor performance are the Single Edge Contact (S.E.C....) cartridge and the Mobile Mini-Cartridge. The S.E.C. cartridge typically combines an area array packaged processor core, L2 cache, other components, and a thermal solution attach point. The entry of the S.E.C. cartridge technology continues the commitment to provide packaging solutions which meet Intel’s rigorous criteria for quality and performance.
The mobile mini-cartridge is a packaging technology aimed at the notebook PC market, where minimum form factor is required. It is designed to protect the electronic components of the product and enables a controlled thermal interface between the processor and the thermal solution in the notebook system. The mini-cartridge provides a socketable microprocessor solution, i.e. it enables the OEM to mount the processor via a motherboard-mounted connector, rather than by soldering it, and mechanically securing it with screws in a manner similar to other notebook components such as hard disk drives. Several times throughout this chapter you will be referred to Intel’s website. The URL for the Intel website is http://www.intel.com. Intel’s developers website can also be accessed through this site.
16.2 Single Edge Contact Cartridge Technology
The S.E.C. cartridge has the following standard features: a plastic enclosure and a substrate with an edge finger connection. The plastic enclosure protects the surface mount components and provides features for mechanical stability when the processor is mounted in a retention mechanism on a motherboard.
Read the full Packaging Databook, Ch. 16.