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Intel® Core™ i7-900 Processor Extreme Edition Series and LGA1366 Socket

This document provides guidelines for the design of thermal and mechanical solutions for the:
• Intel® Core™ i7-900 desktop processor Extreme Edition series
• Intel® Core™ i7-900 desktop processor series
• Intel® Core™ i7-900 desktop processor Extreme Edition series on 32-nm process

Unless specifically required for clarity, this document will use “processor” in place of the specific product names. The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate.

Read the full Intel® Core™ i7-900 Processor Extreme Edition Series and LGA1366 Socket Guide.

Intel® Core™ i7-900 Processor Extreme Edition Series and LGA1366 Socket

This document provides guidelines for the design of thermal and mechanical solutions for the:
• Intel® Core™ i7-900 desktop processor Extreme Edition series
• Intel® Core™ i7-900 desktop processor series
• Intel® Core™ i7-900 desktop processor Extreme Edition series on 32-nm process

Unless specifically required for clarity, this document will use “processor” in place of the specific product names. The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back plate.

Read the full Intel® Core™ i7-900 Processor Extreme Edition Series and LGA1366 Socket Guide.

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