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Intel® C600 Series Chipset Thermal/Mechanical Design Guidelines

Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® C600 Series Chipset.
• Describe reference thermal solutions that meet the specifications of the Intel C600 Series Chipset.

Properly designed thermal solutions provide adequate cooling to maintain the Intel C600 Series Chipset case temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the Intel C600 Series Chipset case temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the component. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the Intel C600 Series Chipset component only. For thermal design information on other chipset components, refer to the respective component TMSDG.

Read the full Intel® C600 Series Chipset: Thermal Guide http://www.intel.com/content/www/us/en/chipsets/c600-series-chipset-thermal-guide.html

Introduction

As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or passive heatsinks.

The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® C600 Series Chipset.
• Describe reference thermal solutions that meet the specifications of the Intel C600 Series Chipset.

Properly designed thermal solutions provide adequate cooling to maintain the Intel C600 Series Chipset case temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the Intel C600 Series Chipset case temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the component. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.

The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the Intel C600 Series Chipset component only. For thermal design information on other chipset components, refer to the respective component TMSDG.

Read the full Intel® C600 Series Chipset: Thermal Guide http://www.intel.com/content/www/us/en/chipsets/c600-series-chipset-thermal-guide.html

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