Intel® 82870P2 PCI/PCI-X 64-bit Hub 2: Thermal Design Guide
As the complexity of computer systems increases, so do
the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical
methods to improve heat dissipation include selective use of ducting and/or passive heatsinks.
The goals of this
document are to:
• Specify the operating limits of the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) components.
•
Describe two reference thermal solutions that meet the thermal specifications of the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2
(P64H2) component.
Properly designed solutions provide adequate cooling to maintain the P64H2 component die temperatures
at or below thermal specifications. This is accomplished by providing a low local ambient temperature, ensuring adequate
local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the P64H2 component die
temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and
reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent
changes in the operating characteristics of the component.
The simplest and most cost effective method is to improve the
inherent system cooling characteristics through careful design and placement of fans, vents, and ducts. When additional
cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size
of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses
thermal design and specifications for the P64H2 components only. For thermal design information on other chipset
components, refer to the respective component datasheets. For the ICH3-S, refer to the Intel® 82801CA I/O Controller Hub 3
(ICH3-S) Datasheet. For the ICH4, refer to the Intel® 82801DB I/O Controller Hub 4 (ICH4) Datasheet.
The information on
the thermal solutions design provided in this document is for reference only, and suggests good thermal design practices.
All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes
no warranties or representations that merely following all of the instructions presented in this document will result in a
system with adequate thermal performance.
Read the full Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 Thermal Design Guide.
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Intel® 82870P2 PCI/PCI-X 64-bit Hub 2: Thermal Design Guide
As the complexity of computer systems increases, so do
the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical
methods to improve heat dissipation include selective use of ducting and/or passive heatsinks.
The goals of this
document are to:
• Specify the operating limits of the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 (P64H2) components.
•
Describe two reference thermal solutions that meet the thermal specifications of the Intel® 82870P2 PCI/PCI-X 64-bit Hub 2
(P64H2) component.
Properly designed solutions provide adequate cooling to maintain the P64H2 component die temperatures
at or below thermal specifications. This is accomplished by providing a low local ambient temperature, ensuring adequate
local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the P64H2 component die
temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and
reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent
changes in the operating characteristics of the component.
The simplest and most cost effective method is to improve the
inherent system cooling characteristics through careful design and placement of fans, vents, and ducts. When additional
cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size
of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses
thermal design and specifications for the P64H2 components only. For thermal design information on other chipset
components, refer to the respective component datasheets. For the ICH3-S, refer to the Intel® 82801CA I/O Controller Hub 3
(ICH3-S) Datasheet. For the ICH4, refer to the Intel® 82801DB I/O Controller Hub 4 (ICH4) Datasheet.
The information on
the thermal solutions design provided in this document is for reference only, and suggests good thermal design practices.
All responsibility for determining the adequacy of any thermal or system design remains solely with the reader. Intel makes
no warranties or representations that merely following all of the instructions presented in this document will result in a
system with adequate thermal performance.
Read the full Intel® 82870P2 PCI/PCI-X 64-bit Hub 2 Thermal Design Guide.
