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Intel® 6400/6402 Advanced Memory Buffer: Thermal Guide
Thermal/Mechanical Design Guide For the Intel® 5000 Chipset Series-based Platforms
As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting and/or passive heat dissipation devices.
The goals of this document are to: • Outline the mechanical operating limits and specifications for the Intel® 6400/6402 Advanced Memory Buffer. • Outline the thermal operating limits and specifications for the Intel® 6400/6402 Advanced Memory Buffer specific to that of the Intel 5000® Chipset Series-based platforms. • Outline reference TDP specifications for FB-DIMM specific to that of the Intel 5000® Chipset Series-based platforms. • Describe an Intel 6400/6402 Advanced Memory Buffer-only wire clip heatspreader reference thermal solution. • Describe an Intel 6400/6402 Advanced Memory Buffer-only c-clip heatspreader reference thermal solution. • Describe a full DIMM heatspreader reference thermal solution. Properly designed thermal solutions provide adequate cooling to maintain the Intel 6400/6402 Advanced Memory Buffer die temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the Intel 6400/6402 Advanced Memory Buffer die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component. The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise. This document addresses thermal design and specifications for the Intel 6400/6402 Advanced Memory Buffer components only. For thermal design information on other chipset components, refer to the respective component datasheet. For the PXH, refer to the Intel® 6700PXH 64-bit PCI Hub (PXH) Thermal/Mechanical Design Guidelines. For the Intel 631xESB/632xESB I/O Controller Hub, refer to the Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design Guide.
Note: Unless otherwise specified, the term “GB” refers to the Intel 6400/6402 Advanced Memory Buffer.
Read the full Intel® 6400/6402 Advanced Memory Buffer Thermal Guide.

Intel® 6400/6402 Advanced Memory Buffer: Thermal Guide
Thermal/Mechanical Design Guide For the Intel® 5000 Chipset Series-based Platforms
As the complexity of computer systems increases, so do the power dissipation requirements. Care must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting and/or passive heat dissipation devices.
The goals of this document are to: • Outline the mechanical operating limits and specifications for the Intel® 6400/6402 Advanced Memory Buffer. • Outline the thermal operating limits and specifications for the Intel® 6400/6402 Advanced Memory Buffer specific to that of the Intel 5000® Chipset Series-based platforms. • Outline reference TDP specifications for FB-DIMM specific to that of the Intel 5000® Chipset Series-based platforms. • Describe an Intel 6400/6402 Advanced Memory Buffer-only wire clip heatspreader reference thermal solution. • Describe an Intel 6400/6402 Advanced Memory Buffer-only c-clip heatspreader reference thermal solution. • Describe a full DIMM heatspreader reference thermal solution. Properly designed thermal solutions provide adequate cooling to maintain the Intel 6400/6402 Advanced Memory Buffer die temperatures at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the Intel 6400/6402 Advanced Memory Buffer die temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component. The simplest and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise. This document addresses thermal design and specifications for the Intel 6400/6402 Advanced Memory Buffer components only. For thermal design information on other chipset components, refer to the respective component datasheet. For the PXH, refer to the Intel® 6700PXH 64-bit PCI Hub (PXH) Thermal/Mechanical Design Guidelines. For the Intel 631xESB/632xESB I/O Controller Hub, refer to the Intel® 631xESB/632xESB I/O Controller Hub Thermal/Mechanical Design Guide.
Note: Unless otherwise specified, the term “GB” refers to the Intel 6400/6402 Advanced Memory Buffer.
Read the full Intel® 6400/6402 Advanced Memory Buffer Thermal Guide.

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