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Design Guide: 603 Pin Socket for Intel® Xeon® Processors
Objective
This document defines a ZIF (Zero Insertion Force) socket intended for workstation and server platforms based on future Intel microprocessors. The socket provides I\O, power, and ground contacts. The socket must be low cost, low risk, robust, high volume manufacturable (HVM), and multisourceable. The socket has 603 contacts with solder balls/surface mount features for surface mounting with the motherboard. The 603 Pin Socket contacts have 50mil pitch with regular pin array, to mate with 603 pins on the Intel® Xeon® processor package.
Purpose:
To define functional, quality, reliability, and material (that is, visual, dimensional, and physical) requirements and design guidelines of the 603 Pin Socket. To provide a 603 Pin Socket that meets or exceeds applicable standards and Intel manufacturing criteria. The 603 Pin Socket must be surface mountable and meet all the reliability requirements.
Scope:
This design guideline applies to all 603-pin ZIF sockets purchased to the requirements of this design guideline.
Processor Pin Field Description:
Information provided in this section is to ensure dimensional compatibility of the 603 Pin Socket with that of the Intel Xeon processor. The processor must be inserted into the 603 Pin Socket with zero insertion force when the socket is not actuated.
Processor pin field without Heatsink:
The outline of the processor that can be used with the 603 Pin Socket is illustrated. This drawing does not include potential heat sinks since these are used at the OEM's discretion. Specific details can be obtained from Intel Xeon Processor Thermal Design Guidelines. Consult your Intel field representative to obtain this document.
Pin Dimensions:
Details of the pin dimensions are shown. All dimensions are Metric. Note that the pin diameter may vary by +0.05/-0.025mm and effective pin length by 0.076mm. The pin base material is Kovar. The plating material and thickness is 8 in of Au over 80 in of Ni. The package Critical To Function (CTF) Dimensions are presented.
Read the full 603 Pin Socket for Intel® Xeon® Processors Design Guide.

Design Guide: 603 Pin Socket for Intel® Xeon® Processors
Objective
This document defines a ZIF (Zero Insertion Force) socket intended for workstation and server platforms based on future Intel microprocessors. The socket provides I\O, power, and ground contacts. The socket must be low cost, low risk, robust, high volume manufacturable (HVM), and multisourceable. The socket has 603 contacts with solder balls/surface mount features for surface mounting with the motherboard. The 603 Pin Socket contacts have 50mil pitch with regular pin array, to mate with 603 pins on the Intel® Xeon® processor package.
Purpose:
To define functional, quality, reliability, and material (that is, visual, dimensional, and physical) requirements and design guidelines of the 603 Pin Socket. To provide a 603 Pin Socket that meets or exceeds applicable standards and Intel manufacturing criteria. The 603 Pin Socket must be surface mountable and meet all the reliability requirements.
Scope:
This design guideline applies to all 603-pin ZIF sockets purchased to the requirements of this design guideline.
Processor Pin Field Description:
Information provided in this section is to ensure dimensional compatibility of the 603 Pin Socket with that of the Intel Xeon processor. The processor must be inserted into the 603 Pin Socket with zero insertion force when the socket is not actuated.
Processor pin field without Heatsink:
The outline of the processor that can be used with the 603 Pin Socket is illustrated. This drawing does not include potential heat sinks since these are used at the OEM's discretion. Specific details can be obtained from Intel Xeon Processor Thermal Design Guidelines. Consult your Intel field representative to obtain this document.
Pin Dimensions:
Details of the pin dimensions are shown. All dimensions are Metric. Note that the pin diameter may vary by +0.05/-0.025mm and effective pin length by 0.076mm. The pin base material is Kovar. The plating material and thickness is 8 in of Au over 80 in of Ni. The package Critical To Function (CTF) Dimensions are presented.
Read the full 603 Pin Socket for Intel® Xeon® Processors Design Guide.

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